Virtual body-contacted trigate

ABSTRACT

A field effect transistor (FET) and method of forming the FET comprises a substrate; a silicon germanium (SiGe) layer over the substrate; a semiconductor layer over and adjacent to the SiGe layer; an insulating layer adjacent to the substrate, the SiGe layer, and the semiconductor layer; a pair of first gate structures adjacent to the insulating layer; and a second gate structure over the insulating layer. Preferably, the insulating layer is adjacent to a side surface of the SiGe layer and an upper surface of the semiconductor layer, a lower surface of the semiconductor layer, and a side surface of the semiconductor layer. Preferably, the SiGe layer comprises carbon. Preferably, the pair of first gate structures are substantially transverse to the second gate structure. Additionally, the pair of first gate structures are preferably encapsulated by the insulating layer.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The embodiments of the invention generally relate to semiconductordevices, and, more particularly, to a field effect transistor (FET)device.

2. Description of the Related Art

Hybrid orientation technology (HOT) provides surfaces for PFET inversionlayers and surfaces for NFET inversion layers. A low-cost means ofachieving HOT technology results in the device bodies of one type of FETbeing isolated by oxide (silicon on insulator (SOI)) and the other beingphysically connected to the bulk wafer. Trigate devices have been shownin HOT but generally lack a means of electrical threshold voltage(V_(t)) adjustment. Setting the height of the fin in a trigate device onbulk silicon is generally critical because the design requires that thewidth and the height be controlled to assure full depletion andcontrolled short-channel effects.

Trigate technology has been proposed for extending scaling ofcomplementary metal oxide semiconductor (CMOS) technology beyond the 65nm node. Additionally, bulk FinFET integration schemes have beenintroduced that provide either junction-isolated or oxide-isolatedFinFETs. Moreover, as devices physically diminish in size, thresholdvoltage control by doping generally becomes increasingly ineffective dueto dopant fluctuations in the individual devices. Additionally, V_(t)control is becoming a major barrier to the further scaling of CMOSdevices. Therefore, there remains a need for a device which is bettercapable of controlling threshold voltage in FET devices.

SUMMARY OF THE INVENTION

In view of the foregoing, an embodiment of the invention provides afield effect transistor (FET) comprising a substrate; a silicongermanium (SiGe) layer over the substrate; a semiconductor layer overand adjacent to the SiGe layer; an insulating layer adjacent to thesubstrate, the SiGe layer, and the semiconductor layer; a pair of firstgate structures adjacent to the insulating layer; and a second gatestructure over the insulating layer. Preferably, the insulating layer isadjacent to a side surface of the SiGe layer and an upper surface of thesemiconductor layer, a lower surface of the semiconductor layer, and aside surface of the semiconductor layer. Preferably, the SiGe layercomprises carbon. Preferably, the pair of first gate structures aresubstantially transverse to the second gate structure. Additionally, thepair of first gate structures are preferably encapsulated by theinsulating layer.

Another embodiment of the invention provides an integrated circuitcomprising a substrate; a silicon germanium (SiGe) layer adjacent to thesubstrate; a first field effect transistor (FET) adjacent to thesubstrate; and a second FET adjacent to the SiGe layer, wherein thefirst FET may comprise any of a FinFET and a trigate structure, whereinthe second FET may comprise any of a FinFET and a trigate structure, andwherein the first FET may comprise a semiconductor layer over thesubstrate; an insulating layer over the semiconductor layer; adielectric layer over the semiconductor layer; and a polysilicon layerover the dielectric layer and the insulating layer. Moreover, the secondFET may comprise a semiconductor layer over the SiGe layer; a dielectriclayer over the semiconductor layer and adjacent to the SiGe layer; and apolysilicon layer over the dielectric layer and adjacent to the SiGelayer. Furthermore, the SiGe layer may comprise carbon. The integratedcircuit may further comprise a plurality of implant well regions in thesubstrate, wherein at least one of the implant well regions contact theSiGe layer. Additionally, the integrated circuit may further comprise aplurality of implant well regions in the substrate, wherein at least oneof the implant well regions contact the semiconductor layer.

Another aspect of the invention provides a transistor comprising asilicon substrate; a silicon germanium (SiGe) layer over the siliconsubstrate; a first field effect transistor (FET) over the siliconsubstrate; and a second FET contacting the SiGe layer, wherein the firstFET preferably comprises any of a FinFET and a trigate structure, andwherein the second FET preferably comprises a partially depleted FETstructure. Preferably, the first FET comprises a semiconductor layerover the silicon substrate; an insulating layer over the semiconductorlayer; a dielectric layer over the semiconductor layer; and apolysilicon layer over the dielectric layer and the insulating layer.Moreover, the second FET may comprise a semiconductor layer over theSiGe layer; a dielectric layer over the semiconductor layer and adjacentto the SiGe layer; and a polysilicon layer over the dielectric layer andadjacent to the SiGe layer. Also, the SiGe layer preferably comprisescarbon. Preferably, the transistor further comprises a plurality ofimplant well regions in the substrate, wherein at least one of theimplant well regions contact the SiGe layer. Also, the transistor mayfurther comprise a plurality of implant well regions in the substrate,wherein at least one of the implant well regions contact thesemiconductor layer. Preferably, the transistor further comprises aninsulating layer in between the first FET and the silicon substrate.Furthermore, the transistor may comprise a space-charge region in theinsulating layer. Additionally, the transistor preferably furthercomprises a body region in between the second FET and the substrate, thebody region being substantially planar to the SiGe layer. Preferably,the transistor further comprises a neutral region in the body region.Moreover, the first FET preferably comprises a first width and thesecond FET comprises a second width, wherein the second width is greaterthan the first width.

Another embodiment of the invention provides a method of manufacturing afield effect transistor (FET), wherein the method comprises forming asilicon germanium (SiGe) layer over a substrate; depositing asemiconductor layer over and adjacent to the SiGe layer; configuring aninsulating layer adjacent to the substrate, the SiGe layer, and thesemiconductor layer; positioning a pair of first gate structuresadjacent to the insulating layer; and forming a second gate structureover the insulating layer, wherein the configuring may comprise formingthe insulating layer adjacent to a side surface of the SiGe layer and anupper surface of the semiconductor layer, a lower surface of thesemiconductor layer, and a side surface of the semiconductor layer.Preferably, the configuring comprises encapsulating the pair of firstgate structures by the insulating layer.

Another aspect of the invention provides a method of fabricating atransistor, wherein the method comprises forming a silicon germanium(SiGe) layer over a silicon substrate; configuring a first field effecttransistor (FET) over the silicon substrate; and contacting a second FETto the SiGe layer, wherein the configuring preferably comprisescontacting the first FET to the silicon substrate, and wherein theconfiguring preferably comprises forming a semiconductor layer over thesilicon substrate; forming an insulating layer over the semiconductorlayer; forming a dielectric layer over the semiconductor layer; andforming a polysilicon layer over the dielectric layer and the insulatinglayer. Preferably, the second FET is formed by positioning asemiconductor layer over the SiGe layer; positioning a dielectric layerover the semiconductor layer and adjacent to the SiGe layer; andpositioning a polysilicon layer over the dielectric layer and adjacentto the SiGe layer. The method may further comprise forming an insulatinglayer in between the first FET and the substrate and in between thesecond FET and the substrate. Additionally, the method may furthercomprise configuring the first FET with a first width and configuringthe second FET with a second width, wherein the second width is greaterthan the first width.

These and other aspects of embodiments of the invention will be betterappreciated and understood when considered in conjunction with thefollowing description and the accompanying drawings. It should beunderstood, however, that the following description, while indicatingpreferred embodiments of the invention and numerous specific detailsthereof, is given by way of illustration and not of limitation. Manychanges and modifications may be made within the scope of theembodiments of the invention without departing from the spirit thereof,and the embodiments of the invention include all such modifications.

BRIEF DESCRIPTION OF THE DRAWINGS

The embodiments of the invention will be better understood from thefollowing detailed description with reference to the drawings, in which:

FIGS. 1 through 8(B) illustrate successive fabrication schematicdiagrams of an integrated circuit structure according to a firstembodiment of the invention;

FIGS. 9 through 14 illustrate successive fabrication schematic diagramsof an integrated circuit structure according to a second embodiment ofthe invention;

FIGS. 15 through 23 illustrate successive fabrication schematic diagramsof an integrated circuit structure according to a third embodiment ofthe invention; and

FIGS. 24 through 35(B) illustrate successive fabrication schematicdiagrams of an integrated circuit structure according to a fourthembodiment of the invention.

DETAILED DESCRIPTION OF PREFERRED Embodiments of the Invention

The embodiments of the invention and the various features andadvantageous details thereof are explained more fully with reference tothe non-limiting embodiments that are illustrated in the accompanyingdrawings and detailed in the following description. It should be notedthat the features illustrated in the drawings are not necessarily drawnto scale. Descriptions of well-known components and processingtechniques are omitted so as to not unnecessarily obscure theembodiments of the invention. The examples used herein are intendedmerely to facilitate an understanding of ways in which the embodimentsof the invention may be practiced and to further enable those of skillin the art to practice the embodiments of the invention. Accordingly,the examples should not be construed as limiting the scope of theembodiments of the invention.

As mentioned, there remains a need for a device which is better capableof controlling threshold voltage in FET devices. The embodiments of theinvention achieve this by providing structures having self-aligned bodycontacted SiGe-based devices in a trigate configuration. Referring nowto the drawings, and more particularly to FIGS. 1 through 35(B), wheresimilar reference characters denote corresponding features consistentlythroughout the figures, there are shown preferred embodiments of theinvention.

FIGS. 1 through 9(B) illustrate a first embodiment of the invention.First, as shown in FIG. 1, the structure of the first embodiment of theinvention is formed by first beginning with a semiconductor (forexample, silicon) wafer 101 having a preferred thickness ofapproximately 200 to 500 μm. Preferably, the wafer 101 comprises bulksilicon having a {100} crystalline orientation. Thereafter, a layer 103of silicon germanium (SiGe) layer (for example, a p-type SiGe layer),optionally, with carbon, is epitaxially grown on the silicon wafer 101using molecular beam epitaxy (MBE), Atomic Layer Deposition (ALD), orchemical vapor deposition (CVD) techniques, at a preferred growthtemperature of approximately 550° C. For example, up to 1% carbon, byweight, may be added to the SiGe layer 103 to alleviate strain in theSiGe layer 103. The SiGe layer preferably has an approximate thicknessbetween 15 to 50 nm.

Next, another layer of silicon 105 is epitaxially grown over the SiGelayer 103 using well-known MBE or CVD techniques. Preferably, thesilicon layer 105 comprises silicon having a {100} crystallineorientation and a preferred thickness in the approximate range of 7 to50 nm. Use of {100} silicon enables use of high-mobility planes forsubsequently formed channels. Next, as shown in FIG. 2, the trigate bodyis defined by etching the upper silicon layer 105, and then using anetch which etches the exposed SiGe layer 103 selectively with respect tosilicon, stopping on the lower silicon wafer 101. The etching processmay be accomplished using plasma etching, reactive ion etching (RIE),wet etching, or any other well-known etching process suitable for metaloxide semiconductor (MOS) devices. Thereafter, end portions of the SiGelayer 103 are selectively removed to undercut the remaining top siliconregion 105, using an isotropic etch technique, such as a selective etchor by a thermal oxidation at approximately 600° C. which oxidizes SiGeat a much greater rate than Si, followed by an isotropic SiO₂ etch.

As illustrated in FIG. 3, a sacrificial oxide 107 is thermally grownover the device using a high-temperature oxidation, preferably atapproximately 900° C. Next, as shown in FIGS. 4 and 5 the oxide layer107 is removed using a wet etch, preferably a buffered hydrofluoric (HF)solution, and a gate-quality dielectric 109 a is grown or deposited.This dielectric 109 a may comprise silicon dioxide or nitridized silicondioxide, or any of the high-k dielectrics such as hafnium silicate,hafnium dioxide, etc. As shown in FIGS. 6(A) and 6(B), a polysiliconlayer 111 is deposited using a conformal deposition process such as CVD,which will form the body gate of the eventual trigate device.Polysilicon layer 111 is preferably of sufficient thickness tocompletely fill the region undercutting upper silicon region 105, andpreferably has an approximate thickness between 6 and 200 nm.

Next, a resist 120 is deposited on the polysilicon layer 111 andplanarized by, for example, spin-on and etch back processes, until thetop of the portion of the polysilicon layer 111 above the silicon bodyregion 105 is exposed. The resist 120 is then patterned by conventionalphotolithography processes.

Thereafter, an anisotropic RIE process is performed to etch portions ofthe polysilicon layer 111 and oxide layer 109 a to expose the lower andupper silicon layers 101, 105, respectively. The remaining portion ofpolysilicon 111, anchoring the sides of the SiGe layer 103 serve as thebody gate of the device and the remaining portions of polysilicon 111,where protected by resist 120, serves as a contact region of the device.A third dielectric layer 109b is subsequently grown through thermaloxidation and/or nitridation of the exposed silicon surfaces or a high-kdielectric deposited, by CVD or ALD techniques over the exposed portionsof the device as illustrated in FIG. 7. Dielectric layer 109 apreferably has an approximate thickness between 1 and 50 nm, andconformally blends with dielectric layer 109 a in the areas surroundingthe polysilicon body gate regions 111. Moreover, oxide layer 109 bserves as the gate oxide for the eventual field effect transistor (FET)portion of the device. Then, the FET gate is constructed by depositing(using, for example, CVD) a polysilicon layer 113 over the oxide layer109b, as illustrated in FIGS. 8(A) and 8(B) to create a trigatestructure (two body gates 111 and a FET gate 113). Polysilicon layer 113preferably has a height at least twice the height of the fin (siliconregion 105). Additionally, source/drain contacts 112, a main gatecontact 116, and a body gate contact 114 are formed on the device 150using well-known processes.

The first embodiment of the invention provides an effective andinexpensive trigate semiconductor structure 150 and method forfabrication on bulk silicon wafers 101. The first embodiment of theinvention provides a gated body contact 114 which provides good controlof the trigate fin height on bulk silicon 101 by providing an etch-stopmaterial which allows the height of the fin 105 to be largelyindependent on the exact silicon etch time. Furthermore, the gated bodycontact 114 allows for the trigate fins 105 to have a charge injectedinto the body, which enables V_(t) changes, yet allows for the bodypotential to dynamically vary, or “float”, as needed. Thus, deleteriousbody effects such as dependence of V_(t) on substrate bias, and loss ofchannel drive, can be averted by gating the body contact 114 “off” witha voltage more positive than a threshold voltage (in the case of ann-type FET, or the reverse for a p-type FET).

Specifically, the body contact 114 from the substrate 101 to the trigateFET body 111 is electrically continuous only when the body contact gate114 is below a threshold voltage, at which point the body contact 114,surrounded by the body contact gate 111, is accumulated and becomeselectrically conductive (the reverse is true for a p-type trigate FET).Thus, flexibility for optimal operation is achieved in one structure.Accordingly, the device 150 is at least partly isolated by the effect ofan electrical field applied to a semiconductor material.

Accordingly, the first embodiment of the invention provides for theisolation of bulk trigate fins 105 from the substrate 101 with (1)well-controlled fin height, which is key to V_(t) control in thetrigate, (2) well-controlled isolation of the bulk parasitic channel(not shown), and (3) the opportunity to selectively “float” the body ofthe trigate device by the application of a cut-off voltage to theisolation gate 113.

In the second embodiment of the invention illustrated in FIGS. 9 through14, the same base substrate as was provided in the first embodimentincluding the wafer 101, SiGe layer 103, and silicon layer 105 isformed. Thereafter, as shown in FIG. 9, a first mask 106a is patternedover the silicon layer 105 to expose a portion of the underlying siliconlayer 105. A deep implant well region 108 is formed using well-known ionimplantation techniques. For example, the well region 108 may serve asthe eventual p-well region of the device. Depending on the ionimplantation parameters, the well region 108 may alternatively serve asthe eventual n-well region of the device. Next, as illustrated in FIG.10 a hard-mask 110 is deposited over silicon 105 and may have anapproximate thickness between 5 and 50 nm. Hard-mask 110 preferablycomprises silicon dioxide and/or silicon nitride and is preferablyformed using oxidation/nitridation or CVD techniques.

Thereafter, a second mask 106 b is formed over the hard-mask layer 110upon which portions of the mask 106 b and underlying hard-mask layer 110are selectively etched as shown in FIG. 10 down to the layer of theunderlying silicon layer 105. Next, after stripping the second mask 106b, another etching process occurs, as shown in FIG. 11, to removeexposed regions of the silicon layer 105, exposing portions of SiGelayer 103. The left-hand fin 105 in FIG. 11 will generally become theNFET portion of the device and the right-hand fin 205 in FIG. 11 willgenerally become the PFET portion of the device. Of course, thoseskilled in the art would readily recognize that the NFET and PFETportions could be flipped (i.e., right-hand fin 205 becomes NFET andleft-hand fin 105 becomes PFET) depending on the initial ionimplantation parameters when the initial implant well region 108 wasperformed. An optional oxygen ion implantation process (as generallydenoted by the downward arrows in FIG. 11) may also be performed.

Next, as shown in FIG. 12, the remaining regions of hard-mask layer 110are etched, using buffered HF or RIE, and an oxide layer 112 is formedover the exposed portions of the device. The oxide layer 112 is formedin an approximate 600° C. oxidation environment, which oxidizes SiGe ata greatly enhanced rate over that of Si. As shown in FIG. 13, apolysilicon layer 114 is deposited over the device using CVD techniques,and preferably having an approximate thickness between 12 and 150 nm, orabout twice the height of the trigate fins 105, 205, and the polysiliconlayer 114 is planarized. Thereafter, as shown in FIG. 14, thepolysilicon layer 114 is selectively patterned and etched usingwell-known techniques to create a trigate structure 160. The trigatestructure 160 comprises a semiconducting fin 105, 205, channel planes(not shown) on the top and left and right sides of the fin 105, 205, agate dielectric 112 on the channel planes, and a gate electrode 114contiguous to the gate dielectric regions 112.

The second embodiment of the invention provides a structure and methodcapable of providing the electrical setting of the V_(t) in a trigateCMOS device 160 in a manner that provides for the precise control of thefin height. The height of the fin 105, 205 is given by the thickness ofsilicon region 105, which is enabled by the selective etch/oxidationproperties of the SiGe layer 103. Furthermore, for trigate structuresthe ratio of the width of the fin 105, 205 to the height of the fin 105,205 is in a ratio preferably between 2:1 and 1:2. Furthermore, voltagecan be applied to the retrograde well 108 to alter or control the V_(t).

A third embodiment of the invention is illustrated in FIGS. 15 through23. A hybrid SOI base substrate is provided comprising a siliconsubstrate 101 with first surface orientation, a buried oxide region,103, and silicon region 105 with second surface orientation. Preferably,the substrate 101 will have a surface orientation of {100} and thesecond silicon region 105 will have surface orientation of {110},although the opposite, and other combinations are possible. Thereafter,as shown in FIG. 15, a silicon dioxide (SiO₂) layer 100 and a siliconnitride (Si₃N₄) layer 106 are sequentially deposited over the siliconlayer 105. SiO₂ layer 100 preferably has an approximate thicknessbetween 5 and 50 nm while Si₃N₄ layer 106 preferably has an approximatethickness between 5 and 50nm. Next, a selective etching process isperformed, as shown in FIG. 16, to remove portions of the buried oxidelayer 103, silicon layer 105, SiO₂ layer 100, and Si₃N₄ layer 106,thereby exposing portions of the underling substrate layer 101.

As depicted in FIG. 17, sacrificial sidewall spacers 102 are formed onboth sides of the stack made up of the remaining layers of the SiGelayer 103, silicon layer 105, SiO₂ layer 100, and Si₃N₄ layer 106. Thesespacers may comprise CVD silicon dioxide or silicon nitride and arepreferably approximately between 4 and 60 nm wide. The sidewall spacers102 may be formed to a height just below the upper height of the Si₃N₄layer 106. Next, a thin SiGe layer 107 having a preferred thicknessapproximately between 5 and 50 nm is epitaxially grown over the exposedsubstrate 101, followed by epitaxial growth of silicon layer 104,generally up to the height of the silicon layer 105 as shown in FIG. 18.Silicon layer 104 is preferably approximately between 3 and 50 nm thick,and comprises silicon having the same crystalline orientation assubstrate 100. Thereafter, the structure is planarized by etching theSiO₂ layer 100, Si₃N₄ layer 106, and upper portions of the sidewallspacers 102 as shown in FIG. 19, using Chemical-Mechanical Polishingand/or RIE etch back.

Next, an n-well implant region 112 is formed in the silicon layer 104and extending into the substrate layer 101 and around the sidewallspacers 102 and below the SiGe layer 103 as illustrated in FIG. 20.Next, trigate fin regions 104, 105 are patterned with a photo-resist anda selective etching process is performed as illustrated in FIG. 21 tocreate fins from the silicon layer 104 and the silicon layer 105 The finetch can be stopped when its depth extends to the bottom SiGe layer 103,and thus the SiGe region 107 will also be reached in fin 104. Aselective oxidation of the exposed SiGe using O₂ at an approximatetemperature of 600° C. follows. A buffered HF etch is used to remove thesmall amount of silicon dioxide grown on the exposed fin sidewall andtop portions thereof during this oxidation process, leaving most of theoxidized SiGe region intact.

As depicted in FIG. 22, a gate dielectric material 116 is deposited bythermal oxidation/nitridation to form silicon oxynitride and/or use ofALD or CVD techniques to form a high-k material around each of thesilicon layers 104, 105. The thickness of material 116 is preferablyapproximately between 1 and 50 nm. Following this process, a polysiliconlayer 118 is deposited over the device, and is selectively patterned andetched to form gate electrodes. In a slightly alternative embodimentshown in FIG. 23, p-well implant regions 119 are formed along with ann-well implant region 120. Generally, according to the third embodimentof the invention, an n-well region 112 (FIG. 22) may be formed in thebulk p-type silicon layer 101. Alternatively, n-band-isolated p-wellimplant regions 119 may be formed in the bulk p-type silicon layer 101.Still alternatively, p-well implant regions (not shown) may be formed ina bulk n-type silicon layer. Those skilled in the art would readilyunderstand that the n-well 112, 120 and p-well regions 119 could beinterchanged. In yet another alternative embodiment, the SOI layer 101may comprise silicon having a {110} crystalline orientation, where thePFET portion of the device 170 is in the bulk portion of the device 170and the NFET portion of the device 170 is in the SOI layer 101.According to FIGS. 15 through 23, the bulk portion of the device 170 isgenerally defined by the left-hand portion of the device. In all ofthese embodiments, the wells described may be formed by use ofconventional photolithography to pattern resist to form openings wherewells are desired, and an ion implant of n-type or p-type species. Inthe case of the n-band the same mask can be used to implant the n-bandas is used to implant the p-well by using higher energy, and thusdeeper, implantation of the n-band (n-type) species (typically arsenic)as compared to the p-well (p-type) species (typically boron).

Generally, the third embodiment of the invention provides a HOT trigatedevice 170 which is electrical threshold-voltage control enabled, withone device in a SOI layer 101 and the other device in a bulk region.This provides a low-cost hybrid well and back-gate solution toelectrically altering V_(t) through well bias and back-gate bias,respectively. The well regions 112, 119, below the buried oxide 103, iseffectively a back gate for trigate body 105. Setting the V_(t) byelectrical control enables less reliance on doping and thusbetter-controlled device V_(t)s, since doping fluctuation has lessimpact on V_(t) variation when doping is lower, and sinceprocess-induced variation in V_(t) can be corrected electrically withappropriate well and back-gate biases.

A fourth embodiment of the invention is illustrated in FIGS. 24 through35(B). The same base substrate as was provided in the first, and second,embodiments including the bulk wafer 101, SiGe layer 103, and siliconlayer 105 is formed. As with the third embodiment, as shown in FIG. 24,a SiO₂ layer 100 and a Si₃N₄ layer 106 are sequentially deposited overthe silicon layer 105. The approximate thickness of SiO₂ layer 100 ispreferably between 5 and 50 nm, while the approximate thickness of Si₃N₄layer 106 is preferably between 5 and 50 nm. Next, a photoresist mask122 is deposited and selectively patterned over the Si₃N₄ layer 106.Next, optionally, as illustrated in FIG. 25, a selective etching processis performed to remove portions of the SiO₂ layer 100 and Si₃N₄ layer106, thereby exposing portions of the underling silicon layer 105.

Thereafter, the photoresist mask 122 is stripped and the SiO₂ layer 100is etched back such that the end portions of the SiO₂ layer 100 areremoved as depicted in FIG. 26. Next, as illustrated in FIG. 27, theSi₃N₄ layer 106 is removed using well-known etching processes. As shownin FIG. 28, the structure is etched in areas unprotected by the SiO₂layer 100 such that the upper silicon layer 105 and underlying SiGelayer 103 are removed in the exposed areas down to the top surface ofthe underlying silicon substrate layer 101 thereby creating one finstructure 128 and a mesa structure 129. FIG. 29 illustrates thestructure after a selective etch back of the SiGe layer 103 occurs. Thisetch is of sufficient duration to completely undercut the fin 128, butnot sufficient to undercut the mesa 129. The fin structure 128 on theleft-hand side of the device shown in FIG. 29 is supported bysource/drain regions 144, which because they are out-of-plane to theview shown in FIGS. 29 and 30, are depicted in non-hashed lines.

Next, a selective strip removal of the SiO₂ layer 100 occurs, whereby anoptional mask (not shown) is patterned over left-hand fin structure 128in FIG. 29, and the SiO₂ layer 100 over the wider fin structure 129(right-hand fin structure 129 in FIG. 29) is removed. If the fin 128 ismasked during the strip of the SiO₂ layer, the fin 128 will be gatedonly on the sides of structure 128. If fin 128 is not masked, then thetop surface will also be gated and the fin can form a trigatetransistor. The resulting device is illustrated in FIG. 30. Next, aconformal spacer 125 preferably comprising silicon nitride or siliconoxide, is deposited over the entire structure as depicted in FIG. 31.This spacer is preferably approximately between 2.5 to 3.5 times thewidth of fin 129. Thereafter, as shown in FIG. 32, a directional etchingprocess is performed thereby resulting in the spacer 125 being removedexcept for the areas under the silicon layer 105 in both the left-handfin structure 128 and the right-hand fin structure 129 in FIG. 32.

Next, a gate dielectric layer 130 is deposited over the fin structures128, 129 as depicted in FIG. 33. Oxidation and/or nitridation to formsilicon oxinitride and/or CVD/ALD to form high-k dielectrics can be usedto form dielectric layer 130. Preferably, layer 130 is approximatelybetween 1 and 5 nm thick. Next, a polysilicon layer 132 is depositedover the device as shown in FIG. 34 and is selectively etched over thecorresponding fin structure 128 and mesa structure 129 to form gateelectrodes. Preferably, the polysilicon layer 132 is greater than 2times the height of the fins 128, 129.

A space-charge region 134 is formed in each of the fin and mesastructures 128, 129, respectively, of the device 180 shown in FIG.35(A). Region 134 becomes “space-charged” due to the electricalinfluence of the gate electrode 132 which repels a majority of electroncarriers in the bodies of the transistors. Generally, fin structure 128is the fully-depleted FinFET or trigate device and mesa structure 129 isthe partially-depleted bulk-contacted body FET device. Structure 128 ismade of a sufficiently small volume that the gate electrode depletes theentire fin (or body) of majority carriers, making it a so-called “fullydepleted device”, in contrast to mesa structure 129 by virtue of theSiGe/Si layer 103/101 being contiguous with silicon layer 105, which hasa very large volume, and effectively only a portion of the body of thedevice can be depleted of majority carriers by the gate electrode 132,and hence is referred to as “partially depleted”. Additionally, wellregions (not shown) may be implanted in the device 180 to form a PFETand NFET structure according to well-known procedures. FIG. 35(B)illustrates a top view of the device 180 of FIG. 35(A) furtherillustrating the source/drain regions 146 a of the fin structure 128 andthe source/drain regions 146 b of the fin structure 129 with therespective polysilicon gate region 132 of each fin 128, 129.

The fourth embodiment of the invention provides both aninsulator-isolated FinFET or trigate device 128 and a bulk,partially-depleted FET 129 with body contact in a low-cost,low-capacitance process. Thus, the fourth embodiment of the inventionprovides isolation of bulk trigate fins 105 from the substrate 101 withwell-controlled fin height, which is key to V_(t) control in trigatestructures, and well-controlled isolation of the bulk parasitic channel.The fin height is controlled accurately by virtue of the SiGe layer 103,which allows one to construct fin height equal to the thickness of thesilicon layer 105 above the SiGe layer 103. Furthermore, the partiallydepleted FET 129 can have V_(t) further adjusted by application ofelectrical bias to the its substrate 101. The fourth embodiment of theinvention utilizes SiGe-based bulk integration for generating FinFETsand/or trigates on a bulk substrate 101. By the addition of a limitedselective etch back of the SiGe layer 103, followed by a thin oxide fillprocess, the fourth embodiment of the invention achieves bothoxide-isolated fins and bulk-connected FETs.

The several embodiments of the invention can be formed into integratedcircuit chips. The resulting integrated circuit chips can be distributedby the fabricator in raw wafer form (that is, as a single wafer that hasmultiple unpackaged chips), as a bare die, or in a packaged form. In thelatter case the chip is mounted in a single chip package (such as aplastic carrier, with leads that are affixed to a motherboard or otherhigher level carrier) or in a multichip package (such as a ceramiccarrier that has either or both surface interconnections or buriedinterconnections). In any case the chip is then integrated with otherchips, discrete circuit elements, and/or other signal processing devicesas part of either (a) an intermediate product, such as a motherboard, or(b) an end product. The end product can be any product that includesintegrated circuit chips, ranging from toys and other low-endapplications to advanced computer products having a display, a keyboardor other input device, and a central processor.

The foregoing description of the specific embodiments will so fullyreveal the general nature of the embodiments of the invention thatothers can, by applying current knowledge, readily modify and/or adaptfor various applications such specific embodiments without departingfrom the generic concept, and, therefore, such adaptations andmodifications should and are intended to be comprehended within themeaning and range of equivalents of the disclosed embodiments. It is tobe understood that the phraseology or terminology employed herein is forthe purpose of description and not of limitation. Therefore, while theembodiments of the invention has been described in terms of preferredembodiments, those skilled in the art will recognize that theembodiments of the invention can be practiced with modification withinthe spirit and scope of the appended claims.

1. A field effect transistor (FET) comprising: a substrate; a silicongermanium (SiGe) layer over said substrate; a semiconductor layer overand adjacent to said SiGe layer; an insulating layer adjacent to saidsubstrate, said SiGe layer, and said semiconductor layer; a pair offirst gate structures adjacent to said insulating layer; and a secondgate structure over said insulating layer.
 2. The FET of claim 1,wherein said insulating layer is adjacent to a side surface of said SiGelayer and an upper surface of said semiconductor layer, a lower surfaceof said semiconductor layer, and a side surface of said semiconductorlayer.
 3. The FET of claim 1, wherein said SiGe layer comprises carbon.4. The FET of claim 1, wherein said pair of first gate structures aresubstantially transverse to said second gate structure.
 5. The FET ofclaim 1, wherein said pair of first gate structures are encapsulated bysaid insulating layer.
 6. An integrated circuit comprising: a substrate;a silicon germanium (SiGe) layer adjacent to said substrate; a firstfield effect transistor (FET) adjacent to said substrate; and a secondFET adjacent to said SiGe layer.
 7. The integrated circuit of claim 6,wherein said first FET comprises any of a FinFET and a trigatestructure.
 8. The integrated circuit of claim 6, wherein said second FETcomprises any of a FinFET and a trigate structure.
 9. The integratedcircuit of claim 6, wherein said first FET comprises: a semiconductorlayer over said substrate; an insulating layer over said semiconductorlayer; a dielectric layer over said semiconductor layer; and apolysilicon layer over said dielectric layer and said insulating layer.10. The integrated circuit of claim 6, wherein said second FETcomprises: a semiconductor layer over said SiGe layer; a dielectriclayer over said semiconductor layer and adjacent to said SiGe layer; anda polysilicon layer over said dielectric layer and adjacent to said SiGelayer.
 11. The integrated circuit of claim 6, wherein said SiGe layercomprises carbon.
 12. The integrated circuit of claim 6, furthercomprising a plurality of implant well regions in said substrate,wherein at least one of said implant well regions contact said SiGelayer.
 13. The integrated circuit of claim 9, further comprising aplurality of implant well regions in said substrate, wherein at leastone of said implant well regions contact said semiconductor layer.
 14. Atransistor comprising: a silicon substrate; a silicon germanium (SiGe)layer over said silicon substrate; a first field effect transistor (FET)over said silicon substrate; and a second FET contacting said SiGelayer.
 15. The transistor of claim 14, wherein said first FET comprisesany of a FinFET and a trigate structure.
 16. The transistor of claim 14,wherein said second FET comprises a partially depleted FET structure.17. The transistor of claim 14, wherein said first FET comprises: asemiconductor layer over said silicon substrate; an insulating layerover said semiconductor layer; a dielectric layer over saidsemiconductor layer; and a polysilicon layer over said dielectric layerand said insulating layer.
 18. The transistor of claim 14, wherein saidsecond FET comprises: a semiconductor layer over said SiGe layer; adielectric layer over said semiconductor layer and adjacent to said SiGelayer; and a polysilicon layer over said dielectric layer and adjacentto said SiGe layer.
 19. The transistor of claim 14, wherein said SiGelayer comprises carbon.
 20. The transistor of claim 14, furthercomprising a plurality of implant well regions in said substrate,wherein at least one of said implant well regions contact said SiGelayer.
 21. The transistor of claim 17, further comprising a plurality ofimplant well regions in said substrate, wherein at least one of saidimplant well regions contact said semiconductor layer.
 22. Thetransistor of claim 14, further comprising an insulating layer inbetween said first FET and said silicon substrate.
 23. The transistor ofclaim 22, further comprising a space-charge region in said insulatinglayer.
 24. The transistor of claim 14, further comprising a body regionin between said second FET and said substrate, said body region beingsubstantially planar to said SiGe layer.
 25. The transistor of claim 24,further comprising a neutral region in said body region.
 26. Thetransistor of claim 14, wherein said first FET comprises a first widthand said second FET comprises a second width, wherein said second widthis greater than said first width.
 27. A method of manufacturing a fieldeffect transistor (FET), said method comprising: forming a silicongermanium (SiGe) layer over a substrate; depositing a semiconductorlayer over and adjacent to said SiGe layer; configuring an insulatinglayer adjacent to said substrate, said SiGe layer, and saidsemiconductor layer; positioning a pair of first gate structuresadjacent to said insulating layer; and forming a second gate structureover said insulating layer.
 28. The method of claim 27, wherein saidconfiguring comprising forming said insulating layer adjacent to a sidesurface of said SiGe layer and an upper surface of said semiconductorlayer, a lower surface of said semiconductor layer, and a side surfaceof said semiconductor layer.
 29. The method of claim 27, wherein saidconfiguring comprises encapsulating said pair of first gate structuresby said insulating layer.
 30. A method of fabricating a transistor, saidmethod comprising: forming a silicon germanium (SiGe) layer over asilicon substrate; configuring a first field effect transistor (FET)over said silicon substrate; and contacting a second FET to said SiGelayer.
 31. The method of claim 30, wherein said configuring comprisescontacting said first FET to said silicon substrate.
 32. The method ofclaim 30, wherein said configuring comprises: forming a semiconductorlayer over said silicon substrate; forming an insulating layer over saidsemiconductor layer; forming a dielectric layer over said semiconductorlayer; and forming a polysilicon layer over said dielectric layer andsaid insulating layer.
 33. The method of claim 30, wherein said secondFET is formed by: positioning a semiconductor layer over said SiGelayer; positioning a dielectric layer over said semiconductor layer andadjacent to said SiGe layer; and positioning a polysilicon layer oversaid dielectric layer and adjacent to said SiGe layer.
 34. The method ofclaim 30, further comprising forming an insulating layer in between saidfirst FET and said substrate and in between said second FET and saidsubstrate.
 35. The method of claim 30, further comprising configuringsaid first FET with a first width and configuring said second FET with asecond width, wherein said second width is greater than said firstwidth.